Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
D. A. Beck (auth.), Gerald A. Walker (eds.)Catégories:
Année:
1962
Edition:
1
Editeur::
Springer US
Langue:
english
Pages:
328
ISBN 10:
1489973117
ISBN 13:
9781489973115
Fichier:
PDF, 22.64 MB
IPFS:
,
english, 1962